Nvidia news
On October 21, 2026, at GTC Berlin, NVIDIA announced major manufacturing and capacity expansion agreements with key global supply chain partners to relieve production bottlenecks for its accelerated computing platforms and AI factories. The agreements span advanced substrates, packaging, testing, and optical interconnects. NVIDIA entered substrate capacity pacts with IBIDEN, Samsung Electro--Mechanics, and Unimicron Technology Corporation to achieve an aggregate 2.5--fold increase in substrate output over the next three years. Additionally, King Yuan Electronics (KYEC) will build new semiconductor testing facilities in the United States supported by a $1.1 billion capacity reservation advance from NVIDIA, Amkor Technology committed to scaling its advanced packaging capacity by over 300% by late 2028, and Siliconware Precision Industries (SPIL) agreed to expand co--packaged optical engine capacity by 15x by mid--2027.