ASML stock
On October 16, 2026, research published by SemiAnalysis revealed that patent filings and technical roadmaps indicate ASML Holding NV is developing a proprietary die--to--wafer hybrid bonding tool. The move signals an expansion beyond core lithography into advanced packaging, positioning ASML as a potential direct competitor to BE Semiconductor Industries (Besi) in next--generation 3D heterogeneous chip integration.