TSMC stock
On October 8, 2026, GlobalFoundries announced a multi--year manufacturing agreement with TSMC valued at $2 billion over an initial five--year term to supply silicon interposers for TSMC's Chip--on--Wafer--on--Substrate (CoWoS) advanced packaging ecosystem. Under the agreement, GlobalFoundries will expand manufacturing capacity at its Malta, New York facility to establish the first U.S.--based production source for silicon interposers, including units with embedded deep--trench capacitors. Volume production is scheduled to begin ramping in the first half of 2028. The partnership addresses critical advanced packaging supply constraints for TSMC and establishes a domestic U.S. packaging pipeline for high--performance computing and artificial intelligence processors.