ASML stock
On October 6, 2026, ASML Holding NV and Taiwan Semiconductor Manufacturing Co. (TSMC) disclosed plans for an extended High--NA extreme ultraviolet (EUV) technical roadmap introducing 12--inch photomasks. Under the roadmap, TSMC intends to commence high--volume High--NA production using existing six--inch masks in 2030, with both companies targeting a 12--inch photomask pilot line in 2031 and commercial production--ready lithography scanners by 2033. The transition to 12--inch masks aims to eliminate optical stitching limits, improve wafer scanner throughput, and reduce advanced chipmaking costs, though analysts highlighted that the multi--year development horizon increases long--term execution risk relative to ASML's premium valuation.