TSMC stock
On June 7, 2026, TSMC announced the successful installation and initial calibration of its first High--NA EUV (Extreme Ultraviolet) lithography system at its Hsinchu R&D center. This advanced equipment is essential for the development of the A14 (1.4nm) process node, which is scheduled for risk production in late 2027. The integration of High--NA technology is expected to reduce pattern complexity and improve yields for future transistor architectures, reinforcing TSMC's technological lead over industry competitors.