TSMC stock
On October 19, 2026, industry reports revealed that Samsung Electronics agreed to outsource the fabrication of logic base dies for Nvidia's next--generation custom high--bandwidth memory (HBM4E/NVHBM) to TSMC's 3--nanometer (3nm) process node. Marking a departure from Samsung's conventional turnkey manufacturing approach, the decision stems from Nvidia's stringent performance and power specifications, which necessitated TSMC's advanced 3nm foundry platform for the memory controller logic. This arrangement consolidates TSMC's market dominance across leading--edge artificial intelligence accelerators and heterogeneously integrated packaging ecosystems.