TSMC stock
On July 13, 2026, TSMC announced the successful installation and calibration of its first High--NA (Numerical Aperture) EUV lithography system from ASML at its Hsinchu R&D center. This equipment is essential for the development of the "A10" (1nm--class) process node, scheduled for risk production in late 2027. By securing and operationalizing this next--generation lithography technology, TSMC maintains its technological lead over competitors in the race toward sub--2nm scaling, providing long--term visibility for its advanced node roadmap.