TSMC stock
On September 5, 2026, TSMC announced that its first commercial Fan--Out Panel--Level Packaging (FOPLP) production line has achieved qualification and is scheduled for mass production in early 2027. By utilizing rectangular panels rather than traditional circular wafers, FOPLP significantly increases the usable area for chip placement, improving throughput and reducing unit costs for advanced AI and mobile processors. This milestone marks a critical step in TSMC’s strategy to address the capacity constraints of its existing CoWoS (Chip on Wafer on Substrate) packaging lines and maintain its leadership in the high--growth AI semiconductor market.