TSMC stock
On June 8, 2026, TSMC and MediaTek announced a strategic expansion of their partnership, with MediaTek securing significant capacity for its next--generation "Dimensity 9600" series on TSMC’s N3P (3nm--enhanced) process. This agreement ensures high utilization rates for TSMC’s 3nm facilities through 2027 and reinforces the company's dominance in the premium mobile SoC (System on Chip) market. The N3P node offers improved power efficiency and transistor density compared to the standard 3nm process, catering to the increasing performance requirements of AI--enabled smartphones.