TSMC stock
On October 27, 2026, industry reports revealed that Taiwan Semiconductor Manufacturing Co. (TSMC) is planning a 10% to 20% price hike for its Chip--on--Wafer--on--Substrate (CoWoS) advanced packaging services. The anticipated price increase stems from severe capacity bottlenecks driven by escalating demand for artificial intelligence processors and custom ASICs from major clients such as Nvidia and AMD. With equipment delivery lead times extending to eight months and packaging capacity trailing market requirements despite aggressive expansion, the upward price revisions are positioned to expand gross margins for TSMC's advanced packaging division and reinforce pricing power across its high--performance computing ecosystem.